電子產品製造工藝多場多尺度建模分析 (英文) 9787121444807 李輝 ... (等) 著

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書名：電子產品製造工藝多場多尺度建模分析 (英文)
ISBN：9787121444807
出版社：電子工業
著編譯者：李輝 ... (等) 著
頁數：167頁
所在地：中國大陸 *此為代購商品
書號：1519870
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內容簡介

本書介紹了兩種典型電子產品汽車壓力感測器和FPCB的製造工藝研究，分別對其關鍵製造工藝過程進行了多場多尺度建模分析，涵蓋了分子動力學與有限元建模分析、工藝參數設計與優化、工藝性能實驗驗證。全書共10章，彙集了兩種典型電子產品的關鍵工藝過程，包括銅-銅引線鍵合工藝中微觀接觸過程，六種典型材料引線鍵合工藝性能比較，汽車壓力感測器灌封工藝中芯片殘餘應力分析，汽車壓力感測器引線鍵合焊點的熱循環失效分析，FPCB化錫工藝分子動力學研究，FPCB曝光工藝中光場分析，FPCB蝕刻工藝中蝕刻劑噴淋特性研究，FPCB蝕刻腔中蝕刻劑濃度分佈與流場特性分析，FPCB蝕刻工藝中蝕刻腔幾何形貌演化過程分析，FPCB多蝕刻腔蝕刻過程分析。本書針對MEMS和FPCB製造工藝中的實際問題，建立物理模型和數值模擬模型，基於有限元和分子動力學方法，模擬電子產品製造過程中材料、微觀結構的演變，揭示加工過程中電子產品變形、應力、缺陷的形成機理與演化機制，在此基礎上提出變形、應力與缺陷的抑制策略及調控理論，指導工藝優化，提高電子產品良率。

目錄

Chapter 1 Investigation on micro contact in Cu-Cu wire bonding process
1 1 Introduction
1 2 Molecular dynamics modeling of Cu-Cu wire bonding
1 3 Results and discussions
1 3 1 Formation and breakage processes of Cu-Cu weld
1 3 2 Analysis of Cu-Cu indentation morphology
1 3 3 Analysis of Cu-Cu atomic stress distribution
1 4 Conclusions
References
Chapter 2 Investigation on wire bonding performance with six typical material pairs
2 1 Introduction
2 2 Molecular dynamics modeling of six material pairs
2 3 Results and discussions
2 3 1 Analysis of bonding forces and system energy
2 3 2 Analysis of atomic morphology for six material pairs
2 3 3 Analysis of atomic stress distribution for six material pairs
2 3 4 Four critical displacement points of six material pairs
2 4 Conclusions
References
Chapter 3 Investigation on residual stress on chip of automobile pressure sensor in potting process
3 1 Introduction
3 2 Thermal experiment of MEMS pressure sensor
3 3 Analytic analysis of thermal stress on sensitive structure
3 4 Modeling and Simulation
3 4 1 Geometric model of MEMS pressure sensor
3 4 2 Finite element model of MEMS pressure sensor
3 4 3 Finite element simulation of residual stress
3 5 Conclusions
References
Chapter 4 Investigation on thermal cycle failure of wire bonding weld in automobile pressure sensor
4 1 Introduction
4 2 Thermal cycling experiments of the MEMS pressure sensor
4 2 1 A sample of thermal cycling test
4 2 2 Experimental methods of the thermal fatigue test
4 2 3 Experimental results and analysis under thermal cycles
4 3 Numerical simulation
4 3 1 Theoretical model of thermal fatigue
4 3 2 Geometric model of the MEMS pressure sensor
4 3 3 Simulation model of thermal fatigue of solder joint
4 3 4 Simulation results of solder joint failures
4 4 Conclusions
References
Chapter 5 Investigation on acoustic injection on automobile MEMS accelerometer
5 1 Introduction
5 2 Experimental investigation of acoustic injection
5 3 Modeling and simulation
5 3 1 Disassembly of inertial measurement unit (IMU)MPU6050
5 3 2 Geometric model of accelerometer unit
5 3 3 Finite element model of accelerometer sensitive structure
5 3 4 Simulation results and discussion of acoustic injection
5 4 Conclusions
References
Chapter 6 Investigation on wetting behavior of Sn droplet on FPCB substrate surfaces
6 1 Introduction
6 2 Models and methods of different surfaces
6 2 1 Modified embed atom method (MEAM) potential
6 2 2 Simulation models of different surfaces
6 2 3 Experimental procedures of wetting behavior on different surfaces
6 3 Results and discussion
6 3 1 Effect of temperature on wetting behavior
6 3 2 Effect of roughness on wetting behavior
6 3 3 Effect of Sn surface on wetting behavior
6 3 4 Contact angle measurement on different substrate surfaces
6 4 Conclusions
References
Chapter 7 Investigation on etchant spraying characteristics in FPCB etching process
7 1 Introduction
7 2 Equipment of the FPCB etching process
7 3 Numerical simulation of multi-nozzle spraying system
7 3 1 Governing equations of fluid dynamics
7 3 2 Simulation model of spraying equipment
7 4 Results and discussions
7 5 Conclusions
References
Chapter 8 Investigation of etchant concentration distribution and fluid characteristics in FPCB etching cavity
8 1 Introduction
8 2 Model formulation and method of etching process
8 2 1 Governing equations of fluid dynamics and mass flux
8 2 2 Simulation model of the FPCB etching cavity
8 3 Results and discussions
8 4 Conclusions
References
Chapter 9 Investigation of etching cavity evolution in FPCB etching process
9 1 Introduction
9 2 Equipment of the
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